
姓名:歐陽汎怡教授
學歷:美國加州大學洛杉磯分校材料工程博士
專長:電子材料,薄膜製程與分析,固態擴散與界面反應
聯絡地址:工科館509
電話:(03) 5715131ext.34321
E-mail:fyouyang@ess.nthu.edu.tw
實驗室:電子封裝薄膜實驗室(點我進入)
經歷
國立清華大學工程與系統科學系副教授 (2014/08 - 2019/08)
國立清華大學工程與系統科學系助理教授 (2010/09 - 2014/08)
主要教授課程
主要研究領域
● Thin film deposition and characterization 薄膜製程與分析
● Mass transport (diffusion) and interfacial reaction 固態擴散與界面反應
● Electromigration, Thermomigration, and Stress migration 電遷移、熱遷移、應力遷移效應
● Pb-free solders and Cu interconnect 無鉛銲錫與銅內接線路
本實驗室的研究將會專注於微電子覆晶封裝與三維立體封裝(3D IC)技術中的擴散驅動的材料科學研究,
論文發表&專利(節錄)
1. Fan-Yi Ouyang*, K. N. Tu, Yi-Shao Lai, and Andriy M. Gusak, “Effect of entropy production on microstructure change in eutectic SnPb flip chip solder joints by thermomigration.” Appl. Phys. Lett., 89, 221906 (2006).
2. Fan-Yi Ouyang*, Kai Chen, K. N. Tu, and Yi-Shao Lai, "Effect of current crowding on whisker growth at the anode in flip chip solder joints," Appl Phys. Lett., 91, 231919 (2007).
3. Fan-Yi Ouyang*, K. N. Tu, Chin-Li Kao, and Yi-Shao Lai, “Effect of electromigration in the anodic Al interconnect on melting of flip chip solder joints,” Appl. Phys. Lett., 90, 211914 (2007).
4. Jia-Hong Huang*, Fan-Yi Ouyang, G. P. Yu, “Effect of film thickness and Ti interlayer on the structure and properties of nanocrystalline TiN thin film on AISI D2 steel.”,Surface and Coatings Technology, 201, 7043 (2007).
5. Matt Pharr, Kejie Zhao, Zhigang Suo*, Fan-Yi Ouyang and Pilin Liu. Concurrent electromigration and creep in lead-free solder. Journal of Applied Physics 110, 083716 (2011).
6. Fan-Yi Ouyang*, and C.-L. Kao, “In situ observation of thermomigration of Sn atoms to the hot end of 96.5Sn-3Ag-0.5Cu flip chip solder joints”, J. Appl. Phys., 110, 123525 (2011)
7. Fan-Yi Ouyang*, Hao Hsu, Yu-ping Su and Tao-Chih Chang, “Electromigration induced failure on lead-free micro bumps in three-dimensional integrated circuits packaging”, J. Appl. Phys., 110, 123525 (2012)
8. Fan-Yi Ouyang*, K.N. Tu and Yi-Shao Lai, “Effect of electromigration induced joule heating and strain on microstructural recrystallization in eutectic SnPb flip chip solder joints”, Materials Chemistry and physics, 136, 210 (2012)
9. Hsin-Fang Lee, Ji-Jung Kai, Pang-Chun Liu, Wei-Chen Chang, Fan-Yi Ouyang, and Hsiu-Ting Chan, “A comparative study of charge transport in quasi-solid state dye-sensitized solar cells using polymer or nanocomposite gel electrolytes”, Journal of Electroanalytical Chemistry 687 45–50 (2012)
10. Hsin-Fang Lee, Jhih-Lin Wu,Po-ya Hsu, Yung-Liang Tung, Fan-Yi Ouyang,and Ji-Jung Kai, “Enhanced photovoltaic performance and long-term stability of dye-sensitized solar cells by incorporating SiO2nanoparticles in a binary ionic liquid electrolyte ”, Thin solid films, In Press (2012)
11. Chih Chen*, Hsiang-Yao Hsiao, Yuan-Wei Chang, Fanyi Ouyang*, and K. N. Tu “Thermomigration in Solder Joint”, Materials Science & Engineering R, In Press (2012)